QDT-EMSLABS
Take electronic products from specification to production-ready design.
Overview
Moving an electronic product from idea to factory floor means getting dozens of disciplines to agree. QDT-EMSLABS brings them together in one team: requirement analysis, industrial and CAD design, multi-layer PCB layout, firmware, application software, testing, and the documentation manufacturing and quality teams depend on. Company materials also describe access to switching-equipment assembly and testing capacity, including an environmentally controlled electronic manufacturing facility of 12,500 square metres with air conditioning, compressed air and uninterrupted power. That facility is presented as capacity used in EMS delivery; ownership is confirmed for each engagement.
Facility details come from company source materials and describe capacity that may be used in delivery. They do not state that QDT owns every listed site.
Challenges we solve
Design, firmware, layout and manufacturing sit with different vendors, and requirements get lost between them.
Assembly and test problems surface only at the first production run, when changes are slow and expensive.
SOPs, BOMs and drawings trail the design, delaying certification and supplier onboarding.
Component and process choices are made without a clear view of unit cost at volume.
What changes
Specification, design, firmware and documentation stay in one accountable team, so nothing is lost at hand-offs.
Design decisions account for cost, testability and assembly from the first review, not after the first build.
SOPs, OCPs, BOMs and drawings are produced alongside the design, ready for certification and quality processes.
How it works
How a product moves through QDT-EMSLABS.
From specification to production
How a product moves through QDT-EMSLABS.
Press Play the flow, or hover and click any step to see what it does.
Our approach
Each stage ends with something you can review, so decisions stay visible and reversible.
Capture intended use, environment, compliance needs and cost targets in a product design specification.
Select architecture and components, then shape enclosure and CAD assemblies around them.
Multi-layer PCB layout, Gerbers, BOM and firmware developed together and reviewed as one design.
Build prototypes and run electrical, electronic and mechanical tests, debugging until the design is stable.
Hand over SOP and OCP documentation, drawings and test procedures for production partners.
Capabilities
What you get
FAQ
Yes. We review the current design, documentation and test results, then address the gaps that block reliable production.
Yes. Embedded firmware, application software and PCB design are developed by the same team so interfaces stay consistent.
We work with assembly and test capacity described in our company materials. Facility arrangements are confirmed for each engagement.
Start a conversation
Scope, configuration and operating constraints decide what is practical. We will help you find the first sensible step.